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| MC74AC02, MC74ACT02 Quad 2-Input NOR Gate Features * Outputs Source/Sink 24 mA * ACT02 Has TTL Compatible Inputs * Pb-Free Packages are Available VCC 14 13 12 11 10 9 8 14 1 14 http://onsemi.com PDIP-14 N SUFFIX CASE 646 1 1 2 3 4 5 6 7 GND SOIC-14 D SUFFIX CASE 751A 14 1 Figure 1. Pinout: 14-Lead Packages Conductors (Top View) MAXIMUM RATINGS Rating DC Supply Voltage (Referenced to GND) DC Input Voltage (Referenced to GND) DC Output Voltage (Referenced to GND) DC Input Current, per Pin DC Output Sink/Source Current, per Pin DC VCC or GND Current per Output Pin Storage Temperature Symbol VCC Vin Vout Iin Iout ICC Tstg Value -0.5 to +7.0 -0.5 to VCC +0.5 -0.5 to VCC +0.5 20 50 50 -65 to +150 Unit V 14 1 TSSOP-14 DT SUFFIX CASE 948G SOEIAJ-14 M SUFFIX CASE 965 ORDERING INFORMATION V V mA mA mA C See detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet. Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. (c) Semiconductor Components Industries, LLC, 2006 October, 2006 - Rev. 7 1 Publication Order Number: MC74AC02/D MC74AC02, MC74ACT02 RECOMMENDED OPERATING CONDITIONS Symbol VCC Vin, Vout tr, tf Supply Voltage DC Input Voltage, Output Voltage (Ref. to GND) Input Rise and Fall Time (Note 1) AC Devices except Schmitt Inputs Input Rise and Fall Time (Note 2) ACT Devices except Schmitt Inputs Junction Temperature (PDIP) Operating Ambient Temperature Range Output Current - High Output Current - Low VCC @ 3.0 V VCC @ 4.5 V VCC @ 5.5 V VCC @ 4.5 V VCC @ 5.5 V Parameter AC ACT Min 2.0 4.5 0 - - - - - - -40 - - Typ 5.0 5.0 - 150 40 25 10 8.0 - 25 - - Max 6.0 5.5 VCC - - - - - 140 85 -24 24 ns/V C C mA mA ns/V Unit V V tr, tf TJ TA IOH IOL 1. Vin from 30% to 70% VCC; see individual Data Sheets for devices that differ from the typical input rise and fall times. 2. Vin from 0.8 V to 2.0 V; see individual Data Sheets for devices that differ from the typical input rise and fall times. DC CHARACTERISTICS 74AC Symbol Parameter VCC (V) TA = +25C Typ VIH Minimum High Level Input Voltage Maximum Low Level Input Voltage Minimum High Level Output Voltage 3.0 4.5 5.5 3.0 4.5 5.5 3.0 4.5 5.5 3.0 4.5 5.5 VOL Maximum Low Level Output Voltage 3.0 4.5 5.5 3.0 4.5 5.5 IIN IOLD IOHD ICC Maximum Input Leakage Current Minimum Dynamic Output Current Maximum Quiescent Supply Current 5.5 5.5 5.5 5.5 1.5 2.25 2.75 1.5 2.25 2.75 2.99 4.49 5.49 - - - 0.002 0.001 0.001 - - - - - - - 74AC TA = -40C to +85C Unit Conditions Guaranteed Limits 2.1 3.15 3.85 0.9 1.35 1.65 2.9 4.4 5.4 2.56 3.86 4.86 0.1 0.1 0.1 0.36 0.36 0.36 0.1 - - 4.0 2.1 3.15 3.85 0.9 1.35 1.65 2.9 4.4 5.4 2.46 3.76 4.76 0.1 0.1 0.1 0.44 0.44 0.44 1.0 75 -75 40 V VOUT = 0.1 V or VCC - 0.1 V VOUT = 0.1 V or VCC - 0.1 V IOUT = -50 A VIL V VOH V V *VIN = VIL or VIH -12 mA IOH -24 mA -24 mA IOUT = 50 A V V *VIN = VIL or VIH 12 mA IOL 24 mA 24 mA VI = VCC, GND VOLD = 1.65 V Max VOHD = 3.85 V Min VIN = VCC or GND A mA mA A *All outputs loaded; thresholds on input associated with output under test. Maximum test duration 2.0 ms, one output loaded at a time. NOTE: IIN and ICC @ 3.0 V are guaranteed to be less than or equal to the respective limit @ 5.5 V VCC. http://onsemi.com 2 MC74AC02, MC74ACT02 AC CHARACTERISTICS (For Figures and Waveforms - See Section 3 of the ON Semiconductor FACT Data Book, DL138/D) 74AC Symbol Parameter VCC* (V) Min tPLH tPHL Propagation Delay Propagation Delay 3.3 5.0 3.3 5.0 1.5 1.5 1.5 1.5 TA = +25C CL = 50 pF Typ 5.0 4.0 5.0 4.5 Max 7.5 6.0 7.5 6.5 74AC TA = -40C to +85C CL = 50 pF Min 1.0 1.0 1.0 1.0 Max 8.0 6.5 8.0 7.0 ns ns 3-5 3-5 Unit Fig. No. *Voltage Range 3.3 V is 3.3 V 0.3 V. Voltage Range 5.0 V is 5.0 V 0.5 V. DC CHARACTERISTICS 74ACT Symbol Parameter VCC (V) TA = +25C Typ VIH VIL VOH Minimum High Level Input Voltage Maximum Low Level Input Voltage Minimum High Level Output Voltage 4.5 5.5 4.5 5.5 4.5 5.5 4.5 5.5 VOL Maximum Low Level Output Voltage 4.5 5.5 4.5 5.5 IIN ICCT IOLD IOHD ICC Maximum Input Leakage Current Additional Max. ICC/Input Minimum Dynamic Output Current Maximum Quiescent Supply Current 5.5 5.5 5.5 5.5 5.5 1.5 1.5 1.5 1.5 4.49 5.49 - - 0.001 0.001 - - - 0.6 - - - 74ACT TA = -40C to +85C Unit Conditions Guaranteed Limits 2.0 2.0 0.8 0.8 4.4 5.4 3.86 4.86 0.1 0.1 0.36 0.36 0.1 - - - 4.0 2.0 2.0 0.8 0.8 4.4 5.4 3.76 4.76 0.1 0.1 0.44 0.44 1.0 1.5 75 -75 40 V V V VOUT = 0.1 V or VCC - 0.1 V VOUT = 0.1 V or VCC - 0.1 V IOUT = -50 A *VIN = VIL or VIH -24 mA IOH -24 mA IOUT = 50 A *VIN = VIL or VIH 24 mA IOL 24 mA VI = VCC, GND VI = VCC - 2.1 V VOLD = 1.65 V Max VOHD = 3.85 V Min VIN = VCC or GND V V V A mA mA mA A *All outputs loaded; thresholds on input associated with output under test. Maximum test duration 2.0 ms, one output loaded at a time. http://onsemi.com 3 MC74AC02, MC74ACT02 AC CHARACTERISTICS (For Figures and Waveforms - See Section 3 of the ON Semiconductor FACT Data Book, DL138/D) 74ACT Symbol Parameter VCC* (V) Min tPLH tPHL Propagation Delay Propagation Delay 5.0 5.0 1.5 1.5 TA = +25C CL = 50 pF Typ - - Max 8.5 9.5 74ACT TA = -40C to +85C CL = 50 pF Min 1.0 1.0 Max 9.0 10 ns ns 3-6 3-6 Unit Fig. No. *Voltage Range 5.0 V is 5.0 V 0.5 V. CAPACITANCE Symbol CIN CPD Input Capacitance Power Dissipation Capacitance Parameter Value Typ 4.5 30 Unit pF pF Test Conditions VCC = 5.0 V VCC = 5.0 V http://onsemi.com 4 MC74AC02, MC74ACT02 DEVICE ORDERING INFORMATION Device MC74AC02N MC74AC02NG MC74ACT02N MC74ACT02NG MC74AC02D MC74AC02DG MC74AC02DR2 MC74AC02DR2G MC74ACT02D MC74ACT02DG MC74ACT02DR2 MC74ACT02DR2G MC74AC02DT MC74AC02DTR2 MC74AC02DTR2G MC74ACT02DT MC74ACT02DTR2 MC74ACT02DTR2G MC74AC02M MC74AC02MEL MC74AC02MELG MC74ACT02MEL MC74ACT02MELG Package PDIP-14 PDIP-14 (Pb-Free) PDIP-14 PDIP-14 (Pb-Free) SOIC-14 SOIC-14 (Pb-Free) SOIC-14 SOIC-14 (Pb-Free) SOIC-14 SOIC-14 (Pb-Free) SOIC-14 SOIC-14 (Pb-Free) TSSOP-14* TSSOP-14* TSSOP-14* TSSOP-14* TSSOP-14* TSSOP-14* SOEIAJ-14 SOEIAJ-14 SOEIAJ-14 (Pb-Free) SOEIAJ-14 SOEIAJ-14 (Pb-Free) 2500/Tape & Reel 96 Units/Rail 2500/Tape & Reel 96 Units/Rail 2500/Tape & Reel 50 Units/Rail 55 Units/Rail 2500/Tape & Reel 55 Units/Rail Shipping 25 Units/Rail 2000/Tape & Reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *This package is inherently Pb-Free. http://onsemi.com 5 MC74AC02, MC74ACT02 MARKING DIAGRAMS 14 PDIP-14 MC74AC02N AWLYYWWG 1 1 14 MC74ACT02N AWLYYWWG 1 1 ACT02 AWLYWWG 1 14 SOIC-14 14 AC02 AWLYWWG 1 14 ACT 02 ALYWG G AC 02 ALYWG G TSSOP-14 14 SOEIAJ-14 74AC02 ALYWG 1 14 74ACT02 ALYWG 1 14 A = Assembly Location WL, L = Wafer Lot YY, Y = Year WW, W = Work Week G or G = Pb-Free Package (Note: Microdot may be in either location) http://onsemi.com 6 MC74AC02, MC74ACT02 PACKAGE DIMENSIONS PDIP-14 CASE 646-06 ISSUE P 14 8 B 1 7 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. INCHES MIN MAX 0.715 0.770 0.240 0.260 0.145 0.185 0.015 0.021 0.040 0.070 0.100 BSC 0.052 0.095 0.008 0.015 0.115 0.135 0.290 0.310 --- 10 _ 0.015 0.039 MILLIMETERS MIN MAX 18.16 19.56 6.10 6.60 3.69 4.69 0.38 0.53 1.02 1.78 2.54 BSC 1.32 2.41 0.20 0.38 2.92 3.43 7.37 7.87 --- 10 _ 0.38 1.01 A F N -T- SEATING PLANE L C H G D 14 PL K M J M DIM A B C D F G H J K L M N 0.13 (0.005) http://onsemi.com 7 MC74AC02, MC74ACT02 SOIC-14 CASE 751A-03 ISSUE H -A- 14 8 -B- P 7 PL 0.25 (0.010) M B M 1 7 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. G C -T- SEATING PLANE R X 45 _ F D 14 PL 0.25 (0.010) K M M S J TB A S DIM A B C D F G J K M P R MILLIMETERS MIN MAX 8.55 8.75 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 BSC 0.19 0.25 0.10 0.25 0_ 7_ 5.80 6.20 0.25 0.50 INCHES MIN MAX 0.337 0.344 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0_ 7_ 0.228 0.244 0.010 0.019 SOLDERING FOOTPRINT* 7X 7.04 1 0.58 14X 14X 1.52 1.27 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 8 MC74AC02, MC74ACT02 PACKAGE DIMENSIONS TSSOP-14 CASE 948G-01 ISSUE B 14X K REF 0.10 (0.004) 0.15 (0.006) T U S M TU S V N S 2X L/2 14 8 0.25 (0.010) M L PIN 1 IDENT. 1 7 B -U- N F DETAIL E K 0.15 (0.006) T U S J J1 SECTION N-N -W- C 0.10 (0.004) -T- SEATING PLANE D G H DETAIL E SOLDERING FOOTPRINT* 7.06 1 0.36 14X 14X 1.26 *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 9 CCC EEE CCC EEE CCC A -V- K1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE -W-. MILLIMETERS INCHES DIM MIN MAX MIN MAX A 4.90 5.10 0.193 0.200 B 4.30 4.50 0.169 0.177 C --- 1.20 --- 0.047 D 0.05 0.15 0.002 0.006 F 0.50 0.75 0.020 0.030 G 0.65 BSC 0.026 BSC H 0.50 0.60 0.020 0.024 J 0.09 0.20 0.004 0.008 J1 0.09 0.16 0.004 0.006 K 0.19 0.30 0.007 0.012 K1 0.19 0.25 0.007 0.010 L 6.40 BSC 0.252 BSC M 0_ 8_ 0_ 8_ 0.65 PITCH DIMENSIONS: MILLIMETERS MC74AC02, MC74ACT02 PACKAGE DIMENSIONS SOEIAJ-14 CASE 965-01 ISSUE A 14 8 LE Q1 E HE M_ L DETAIL P 1 7 Z D e A VIEW P NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS AND ARE MEASURED AT THE PARTING LINE. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 5. THE LEAD WIDTH DIMENSION (b) DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS AND ADJACENT LEAD TO BE 0.46 ( 0.018). DIM A A1 b c D E e HE 0.50 LE M Q1 Z MILLIMETERS MIN MAX --- 2.05 0.05 0.20 0.35 0.50 0.10 0.20 9.90 10.50 5.10 5.45 1.27 BSC 7.40 8.20 0.50 0.85 1.10 1.50 10 _ 0_ 0.70 0.90 --- 1.42 INCHES MIN MAX --- 0.081 0.002 0.008 0.014 0.020 0.004 0.008 0.390 0.413 0.201 0.215 0.050 BSC 0.291 0.323 0.020 0.033 0.043 0.059 10 _ 0_ 0.028 0.035 --- 0.056 c b 0.13 (0.005) M A1 0.10 (0.004) ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative http://onsemi.com 10 MC74AC02/D |
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